Solder Alloys & Fluxes
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Specification BS EN 29453, Alloy No. |
Specification BS 219 |
Composition |
Melting Range °C |
Applications |
| ALLOY SELECTION GUIDE | ||||
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A wide range of high purity soldering alloys in a variety of formats, including traditional tin and lead based alloys, and RoHS compliant lead-free alloys.
As well as the BS EN 29453 and BS 219 specifications listed below, we can also offer alloys from ISO 9453 and IPC-J-STD-006A specifications on request.
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| 1a | Exceeds AP |
Sn/Pb
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183 | SM Electronics |
| 2a | Exceeds KP | Sn/Pb | 183-190 | SM Electronics |
| 3a | / | Sn/Pb | 183-215 | Electronics |
| 1 | AP | Sn/Pb | 183 | Electronics |
| 2 | KP | Sn/Pb | 183-190 | Electronics |
| 3 | / | Sn/Pb | 183-215 | Tinning |
| 4 | R | Sn/Pb | 183-226 | Electrical/Industrial |
| 5 | G | Sn/Pb | 183-235 | Tinning |
| 6 | H | Sn/Pb | 183-245 | Plumbing/Jointing |
| 7 | J | Sn/Pb | 183-255 | Plumbing/Automotive |
| 8 | / | Sn/Pb | 268-302 | High temperature |
| 9 | / | Sn/Pb | 280-305 | High temperature |
| 10 | / | Sn/Pb | 320-325 | High temperature |
| 11 | A | Sn/Pb/Sb | 183 | Electrical |
| 12 | K | Sn/Pb/Sb | 183-190 | Electrical/Tinning |
| 13 | F | Sn/Pb/Sb | 183-216 | Tinning |
| 14 | C | Sn/Pb/Sb | 185-231 | Tinning |
| 15 | D & L | Sn/Pb/Sb | 185-250 | Plumbing/Jointing |
| 16 | / | Sn/Pb/Sb | 185-263 | Industrial |
| 17 | N | Sn/Pb/Sb | 185-270 | Automotive |
| 18 | 95A | Sn/Sb | 230-240 | Electrical/Industrial, high temperature, Pb free |
| 19 | / | Sn/Pb/Bi | 180-185 | Special applications |
| 20 | / | Sn/Pb/Bi | 178-205 | Special applications |
| 21 | / | Sn/Bi | 138 | Pb/Cd Free low temperature |
| 22 | T | Sn/Pb/Cd | 145 | Low temperature |
| 23 | 99C | Sn/Cu | 230-240 | Pb Free Plumbing |
| 24 | / | Sn/Cu | 230-250 | Pb free |
| 25 | / | Sn/Pb/Cu | 183-190 | Special electronic/Electrical |
| 26 | / | Sn/Pb/Cu | 183-215 | Electrical/Industrial |
| 27 | / | Sn/In | 117-125 | Glass to metal |
| 28 | 96S | Sn/Ag | 221 | High temperature/Pb free electronics |
| 29 | 97S | Sn/Ag | 221-230 | Pb free |
| 30 | 62S | Sn/Pb/Ag | 178-190 | Special SM electronics |
| 31 | / | Sn/Pb/Ag | 178-180 | Special SM electronics |
| 32 | / | Pb/Ag | 304-305 | Special high temperature |
| 33 | / | Pb/Ag | 304-365 | Special high temperature |
| 34 | 5S | Sn/Pb/Ag | 296-301 | High temperature electrical |
| Elements Legend | ||||
| Ag = Silver, Bi = Bismuth, Cd = Cadmium, Cu = Copper, In = Indium, Pb = Lead, Sb = Antimony, Sn = Tin | ||||
| HIGH PURITY™ BAR/STICK SOLDER |
| PAR high purity bar/stick solder is available in Bar (0.5/1Kg), Tinmans (250g), Blowpipe (50-80g), Pellets, Chunks & Chips (1Kg & 5Kg bags) and Ingots (5Kg bars). PAR Bar/Stick solders are intended for general industrial tinning applications. |
| HIGH PURITY™ SOLID SOLDER WIRE |
| PAR solid solder wires are available on a variety of standard and DIN specification reels from 250g - 25Kgs. PAR high purity solid solder wires are intended for general industrial tinning applications. |
| CORED SOLDER WIRE |
| PAR cored solder wires are available on a variety of standard and DIN specification reels from 100g - 25Kgs. PAR cored solder wires are intended for a range of soldering applications. |
| HIGH-SPEED CORED SOLDER WIRE |
| A range of rosin (colophony) based, halide activated cored solder wires in a no clean ROL1 and ROM1 formulations. PAR solders offer the greatest performance required for high speed soldering applications, whether it be automated or manual. High speed cored solder wire exhibits the absolute minimum of clear, no clean soldering residue and can be cleaned with solvent or saponifier cleaning processes, leaving bright solder joints with no white residue. |
| COLOPHONY-FREE CORED SOLDER WIRE |
| A range of colophony free rosin cored solder wires, which contain no rosin/resin acids, pine oil, or other naturally occurring derivatives from pine tress. Colophony free cored solder wires are specifically designed to reduce occurrences of operator asthma, which can occur as a result of using traditional colophony based rosin cored solder wires. |
| NO CLEAN CORED SOLDER WIRE |
| A range of rosin (colophony) based, halide free, fast flowing, no clean cored solder wires. No clean cored solder wires offer the greatest post soldering residue reliability and has become the standard for the telecommunications industry. |
| NO CLEAN CORED SOLDER WIRE - CLEAR RESIDUE |
| This product offers the same benefits as standard no clean cored solder wire, but with the added benefit of a clear post soldering residue. |
| WATER WASH CORED SOLDER WIRE |
| A range of colophony free, water washable cored solder wires. Water wash cored solder wires exhibit minimum fuming during use, and the absolute minimum ionic contamination after cleaning. |
| ACID CORED SOLDER WIRE |
| Mainly used for metal fabrication, acid cored solder wire is particularly suited for use on stainless steel and other hard to solder metals. |
| SOLDER PAINT |
| Solder paint is a liquid, uniformed mixture of finely powdered solder and zinc chloride activated flux, providing a creamy consistency. Solder paint finds use in general sweating and tinning applications. As with other zinc chloride based fluxes, the residue can be corrosive, so it is advisable that such residues be removed. Available in alloys Sn25/Pb75, Sn40/Pb60, Sn60/Pb40, Sn97/Cu3 and Pure Tine. |
| SOLDERING FLUXES & THINNERS |
| PAR have a wide range of soldering fluxes & thinners available to suit various processes, including wave soldering. A range of our general soldering fluxes are listed below, but please contact our sales department with your specific requirements. |
| ALCHO-RE PASTE |
| Resin flux based paste, for general soldering of copper or tinned surfaces where a non-corrosive residue is required. |
| ALCHO-RE FLUID |
| Resin flux based fluid, for general soldering of copper or tinned surfaces where a non-corrosive residue is required. |
| FRY BAKERS FLUID NO.3 |
| Zinc chloride water based fluid, for general soldering of copper, brass and tinned surfaces. Corrosive residues must be removed with water and hydrochloric or citric acid. |
| FRY RADSOL T208B & T208C |
| T208B (Water based) & T208C (Alcohol based) fluxes, for soldering of copper, copper alloys, tinned and certain plated surfaces where a non-corrosive residue is required. (Zinc chloride free). |
