Potting & Encapsulating Resins
| Product Reference | Colour | Thermal Class °C | Description |
|---|---|---|---|
| SEALING & JOINTING COMPOUNDS | |||
|
R391 WEATHERPROOF COMPOUND
|
Black | -20 to +80 | Electrical weatherproof compound, 1 part putty, non-hardening, does not shrink, crack or peel, can be removed by hand |
|
BICASEAL PUTTY
|
Red | -20 to +80 | Electrical weatherproof compound, 2 part putty, solid setting, excellent adhesion, easy to apply |
|
3M® SCOTCHFIL® PUTTY
|
Black | 80 |
Electrical insulation putty in tape form, self amalgamating. |
|
Resin Product Reference |
Colour |
Reactor Product Reference |
Thermal Class °C |
HardnessShore @ 25°C |
POT LIFE | DRY TIME |
Special Properties & Applications |
||
|---|---|---|---|---|---|---|---|---|---|
| 100g @ 25°C | 100g @ 65°C | Initial Cure @ 25°C | Full Cure @ 25°C | ||||||
| POTTING & ENCAPSULATING RESINS | |||||||||
| POLYURETHANE RESINS | |||||||||
| Polyurethane resins are flexible, elastomeric compounds, available from low viscosity to thixotropic pastes. Features include good resistance to moisture & chemicals, excellent impact & abrasion resistance, thermal shock ranging from -40 to + 155°C, excellent electrical and sealing properties, with good noise and vibration dampening properties. | |||||||||
| PAR PC 1022 | Black | PC 1022 | 155 | 80 - 90A Flexible | 60 min | 2 - 4 hrs | 24 hrs |
General purpose filled potting & casting,  UL 94 V-0 |
|
| DOLPHON® CB-1135/A | Black | CB-1135/B | 155 | 60 - 80A Flexible | 45 min | 2 - 4 hrs | 24 hrs | General purpose filled potting & casting | |
| DOLPHON® CC-1135/A | Clear | CC-1135/B | 155 | 55 - 65A Flexible | 45 min | 2 - 4 hrs | 24 hrs | General purpose unfilled potting & casting | |
| DOLPHON® CB-1138/A | Black | CB-1138/B | 130 | 35 - 40D Flexible | 30 min | 0.4 - 1 hr | 24 hrs |
General purpose filled potting & casting, UL 94 V-0 |
|
| POLYBUTADIENE RESINS | |||||||||
| Polybutadiene resins are flexible, elastomeric compounds. Especially formulated for encapsulating electrical & electronic devices, they have excellent hydrolytic stability, good thermal conductivity, low thermal shock ranging from -70 to + 155°C. Other features are extraordinary resistance to moisture and chemicals, excellent adhesion, easy to repair, excellent replacement for silicone and epoxy resins. | |||||||||
|
DOLPHON® CB-1109
|
Black
|
RE-2018
|
155 | 30A Very flexible | 70 min | 2 - 4 hrs | 24 hrs |
General purpose potting & casting
, Coils, transformers, PCB's
|
|
|
DOLPHON® CC-1120
|
Clear
|
CC-1120/B | 155 | 25A Very flexible | 70 min | 3 - 5 hrs | 24 hrs |
Unfilled, low viscosity, repairable, p
articularly suitable for electromagnets
|
|
|
DOLPHON® CB-1128
|
Black
|
CB-1128/B | 155 | 45A Flexible | 45 min | 2 - 4 hrs | 24 hrs |
Flexible, resistant to chemicals & moisture
, especially suitable for traction motors
|
|
|
DOLPHON® CN-1130
|
Cream
|
CN-1130/B | 155 | 50A Flexible | 50 min | 2 - 4 hrs | 24 hrs |
General purpose potting & casting,
UL 94 V-0 |
|
| EPOXY RESINS | |||||||||
| Epoxy resins vary from flexible to rigid compounds and range from low viscosity to paste-like thixotropic adhesives. Features include good resistance to moisture & chemicals, excellent impact & abrasion resistance, thermal shock ranging from -40 to + 180°C, excellent electrical and sealing properties. A series of reactors is available for most products to tailor each system to specific requirements. | |||||||||
| EPOXY RESINS - IMPREGNATING & ENCAPSULATING | |||||||||
| DOLPHON® CC-1024/A | Clear | RE-2000 | 130 | 75D Rigid | 60 min | 2 - 4 hrs | 24 hrs |
Moderate initial gel time
|
|
| Clear |
RE-2013
|
130 | 75D Rigid | 30 min | 2 - 4 hrs | 24 hrs |
Reactor with very low irritant level
|
||
| Clear | RE-2001 | 130 | 65D Semi-rigid | 90 min | 2 - 4 hrs | 24 hrs |
Resistant to low temperatures
|
||
| Clear | RE-2008 | 155 | 60D Flexible | 7 days | 2 hrs | 3 - 5 hrs @ 135°C |
Excellent penetration & flexibility
|
||
| Clear | RE-400/D | 105 | 75D Rigid | 30 min | 2 - 4 hrs | 24 hrs |
Tack free surface, even at low temperatures
|
||
| DOLPHON® CB-1054/A |
Black
|
CB-1054/B | 155 | 60D Flexible | 3 - 4 days | 6 hrs | 3 - 5 hrs @ 135 °C |
MIL-T-27 & MIL-I-16923 approved
|
|
| Black | RE-2000 | 130 | 65D Semi-rigid | 60 min | 2 - 4 hrs | 24 hrs |
Excellent thermal shock & thermal conductivity, good physical/elec. properties
|
||
| Black | RE-2008 | 155 | 60D Flexible | 24 hrs | 4 - 6 hrs | 3 - 5 hrs @ 135°C |
Excellent thermal shock & thermal conductivity, good physical/elec. properties
|
||
| DOLPHON® CC-1079 | Clear | RE-2000 | 130 | 85D Rigid | 35 min | 24 hrs | Unfilled, good insulating properties at high temperatures | ||
| Clear | RE-2008 | 155 | 60D Flexible | 7 days | 4 - 5 hrs | 3 - 5 hrs @ 135°C |
Unfilled, good insulating properties at high temperatures |
||
| DOLPHON® CB-1114 | Black | CC-1114 | 130 | 80D Semi-rigid | 95 min | 3 - 4 hrs | 2 - 4 hrs | 24 hrs |
Filled, halogen free, low shrinkage, tough, flexible film, excellent resistance to moisture & thermal shock, Coils, transformers, electronics |
| DOLPHON® CN-1114 | Neutral | ||||||||
| DOLPHON® CX-1114 | Blue | ||||||||
| DOLPHON® CY-1114 | Yellow | ||||||||
| DOLPHON® CR-1114 | Red | ||||||||
| DOLPHON® CC-1118/LV | Clear | 1 Part | 180 | 85D Rigid | 1 year | 5 - 6 hrs @ 160°C |
1 part, slightly thixotropic, impregnates & encapsulates at the same time
|
||
| EPOXY RESINS - POTTING & ENCAPSULATING | |||||||||
| DOLPHON® CR-1035 | Red | RE-2000 | 130 | 75D Rigid | 60 min | 2 - 4 hrs | 24 hrs | Low viscosity with good penetration, good thermal conductivity, good physical & electrical properties, machinable after curing. Stators, transformers, electronics. | |
| Red | RE-2013 | 130 | 80D Rigid | 30 min | 1 - 2 hrs | 24 hrs | |||
| Red | RE-2001 | 130 | 65D Flexible | 90 min | 2 -4 hrs | 24 hrs | |||
| Red | RE-400/D | 105 | 75D Rigid | 30 min | 1 - 2 hrs | 24 hrs | |||
| DOLPHON® CB-1078 | Black | RE-2000 | 130 | 80D Rigid | 75 min | 2 - 4 hrs | 24 hrs | Medium viscosity, low exotherm, excellent thermal conductivity, good physical & electrical properties, machinable after curing. Stators, transformers, electronics. | |
| Black | RE-2013 | 130 | 85D Rigid | 35 min | 2 - 4 hrs | 24 hrs | |||
| Black | RE-2001 | 130 | 70D Semi-rigid | 75 min | 2 - 4 hrs | 24 hrs | |||
| Black | RE-400/D | 105 | 80D Semi-rigid | 35 min | 2 - 4 hrs | 24 hrs | |||
| DOLPHON® CB-1088 | Black | RE-2000 | 130 | 45D Flexible | 50 min | 2 - 4 hrs | 24 hrs | Flexible for delicate components. PCB's, electronics, coils, transformers | |
| Black | RE-400/D | 105 | 50D Flexible | 35 min | 2 - 4 hrs | 24 hrs | |||
| EPOXY RESINS - ENCAPSULATING & SEALING | |||||||||
| DOLPHON® CR-1034 | Red | RE-2000 | 130 | 80D Rigid | 75 min | 3 - 4 hrs | 24 hrs |
Excellent resistance to moisture & chemicals. Butter-on winding sealer
|
|
| DOLPHON® CG-1062 | Grey | RE-2000 | 130 | 80D Rigid | 75 min | 3 - 4 hrs | 24 hrs |
Excellent resistance to moisture & chemicals.
Brush or dip winding sealer
|
|
| Grey | RE-400/D | 130 | 75D Semi-rigid | 60 min | 3 - 4 hrs | 24 hrs | |||
| Product Reference | Colour | Reactor Product Reference | Resin Type | Product Type | Set Time @ 25°C | Properties |
|---|---|---|---|---|---|---|
| ADHESIVES | ||||||
| PAR MPS HOT MELT ADHESIVE SYSTEM | Natural | 1 Part | Thermoplastic | Hot melt | 20-30 secs | General purpose hot melt adhesive, for the bonding of fabrics, tapes, plastic, metal, wood & card. May be applied by hand or through a gun. |
| 3M® SCOTCH-WELD® 9323-2 B/A | Black | XA-9321 | Epoxy | 2 Part resin | 150 min | Excellent bond strength, high impact resistance, good environmental, resistance, bonds metal to metal. |
| 3M® SCOTCH-GRIP® 847 | Brown | 1 Part | Nitrile rubber | 1 Part resin | 15 min | Quick drying, resistant to many oils & fuels, bonds leather, nitrile rubber, plastics & most gasket materials to a wide variety of substrates. |
| DOLPHON® X-206/A | Clear | X-206/B | Epoxy | 2 Part resin | 60 min | Good bond strength to a variety of substrates, elastic, excellent resistance, to mechanical shock, moisture, oil, solvent, acid & alkali resistant. |
| DOLPHON® CR-1056/B | Red | CR-1056/A | Epoxy | 2 Part paste | 2 hrs | Excellent adhesion & bond strength to a wide variety of substrates, flexible, good mechanical & thermal shock resistance, easy to machine. |
| Product Reference | Colour Part A | Colour Part B | Colour Mixed | Pot Life @ 25°C | Full Cure |
Thermal Class °C |
|---|---|---|---|---|---|---|
| ARMATURE BALANCING COMPOUNDS | ||||||
| ROOM TEMPERATURE CURE | ||||||
|
A range of epoxy compounds for use in the weight addition balancing of electric motor armatures, rotors and fans, as well as sealing and gap filling in general engineering/electronic applications. A smooth putty consistency ensures the compound does not migrate during the balancing process. |
||||||
| BC-22 | Blue | Yellow | Green | 2 hrs | 24 hrs @ 25°C | -40 to +205 |
| BC-28 | Blue | Yellow | Green | 1 hrs | 24 hrs @ 25°C | -40 to+205 |
| BC-29 | Blue | Yellow | Green | 3 hrs | 24 hrs @ 25°C | -40 to +205 |
| 8810 | Yellow | Blue | Green | 4 hrs | 24 hrs @ 25°C | -40 to +205 |
| HEAT CURE | ||||||
|
A range of single part compounds designed to support manual or automatic applications in the weight addition balancing of electric motor armatures, rotors and fans. As the product does not require mixing, both waste and production time are reduced. |
||||||
| BC-10 | White | 1 Part | / | 1 year | 20 mins @ 150°C | -40 to +260 |
| BC-15 | Red | 1 Part | / | 1 year | 20 mins @ 175°C | -40 to +260 |
| UV CURE | ||||||
|
A range of single part compounds designed to support manual or automatic applications in the weight addition balancing of electric motor armatures, rotors and fans. Production time can be vastly increased, as the compound cures in 5 to 30 seconds under a UV lamp. |
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| BC-30 | Purple | 1 Part | / | 1 year | 100 -120 j/cm2 | -40 to +175 |
| BC-40 | Grey | 1 Part | / | 1 year | 100 -120 j/cm2 | -40 to +175 |
| BC-50 | White | 1 Part | / | 1 year | 100 -120 j/cm2 | -40 to +175 |
